MTP to FA

Key Features

• Comprehensive OEM/ODM Customization Services:

  • Channel Count & Pitch: Supports 4, 8, 12, 16, 24, or 32-channel arrays with standard 127 µm / 250 µm pitches or customized sub-micron pitch spacing.

  • Fiber Options: Single-Mode (OS2), Multi-Mode (OM3/OM4/OM5), and Polarization-Maintaining (PM) fibers for polarization-sensitive photonic circuits.

  • Polish Angle & FA Geometry: Customizable V-groove array polish angles (0°, 8°, 45° for edge or surface coupling) and specialized lid glass materials/dimensions.

  • MTP/MPO Interface: Male (pinned) or Female (unpinned) MTP/MTP PRO connectors with standard, low loss, or ultra-low loss (ULL) ferrule configurations.

• Sub-Micron V-Groove Alignment Precision: Engineered with high-precision quartz or silicon V-grooves, guaranteeing tight pitch tolerances (±0.5 µm) for optimal core-to-core optical coupling efficiency.

• Low Insertion Loss & High Return Loss: Precision end-face polishing and stringent alignment techniques ensure minimal coupling loss and superior return loss across all channels.

• Ultra-Compact Footprint: Miniature Fiber Array block design allows seamless integration into space-constrained optical engines and photonic packages.

• Rigorously Tested Quality: 100% factory-inspected for 3D geometry, pitch accuracy, and end-face cleanliness in compliance with Telcordia GR-1221/1209 standards.

Application：

Silicon Photonics (SiPh) & PIC Packaging

800G & 1.6T High-Speed Optical Transceivers

Co-Packaged Optics (CPO) & Near-Packaged Optics (NPO)

Optical Engine & Wafer-Level Chip Testing

Quantum Computing & Advanced Fiber Sensing